Seminar: Mechanics of microfabricated metallic films for freestanding interlocking metamaterials

Abstract
Next-generation interconnects utilizing mechanically interlocking structures enable permanent and reworkable joints between microelectronic devices. Arrays of repeating Microfabricated interlocking structures promise to make packaging of micro devices and micro electronics more efficient and reliable by doing away with traditional technology like solder bump grid arrays, epoxy, and wirebonds. Material choices allow for electrical connections and heat dissipation through the substrate. In this work, analytical models are developed along with optimization schemes to produce the best possible designs. Several designs are presented for re-useable and semi re-useable interlocking mechanical metamaterials are proposed which allow for the mechanical retention of microelectronic components. Analytical models to obtain bond strengths, and internal bending stresses are presented, and are verified through Finite Element Modeling (FEM). Modeling efforts show that the designs presented are capable of reaching bond strengths of 8.2 kPa, which is comparable to commercially available VelcroTM but in microfabricated, self-aligning, electrically conducting designs. Eventual realization of interconnect technology based on this study will provide a great improvement of functionality and adaptability in heterogeneous integration and microdevice packaging.

About the speaker
Geoffrey Garcia is currently an M.S. candidate under the supervision of Dr. Joseph Brown in the Nanosystems lab in the Department of Mechanical Engineering at the University of Hawaiʻi at Mānoa. Geoffrey Received his B.S. degree in Mechanical Engineering in 2019 from the University of Hawaiʻi at Mānoa.